An advanced thermal interface material (TIM) sheet developed by Zeon Corp. (TYO:4205) holds promise in helping to create an energy-efficient, smart, low-carbon economy. This potential stems from TIM’s ability to significantly reduce the temperature of semiconductors used in servers and power devices, where heat generation is a growing technical issue. Great advances in the processing power of semiconductor chips in...
Please subscribe to read the full story.Subscribe
Already a member? Log in here
