Denka has launched Snecton, a low-dielectric organic insulating resin with electrical characteristics required of materials to reduce electrical signal loss in next-generation high-speed communications beyond 5G and 6G. In addition to the sales launch for copper clad laminates (CCL) of various high-speed telecommunications equipment, the product is now being considered for flexible copper clad laminates (FCCL) and various interlayer insulation…
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